The demand for semiconductor and carrier cover packaging materials is increasing


YONGJIA

Release time:

2023-04-10

The packaging material for tape and cover is an important component of current automated production, especially in the application of high-tech. At present, many industries are implementing industrial systems for robot automation production, and the demand for manual labor is rapidly decreasing.

The demand for semiconductor and carrier cover packaging materials is increasing

The packaging material for tape and cover is an important component of current automated production, especially in the application of high-tech. At present, many industries are implementing industrial systems for robot automation production, and the demand for manual labor is rapidly decreasing. This requires many factories to achieve automated processes from production to packaging during production, especially in the development of the semiconductor industry, which is also a major trend in the industry. At present, the important material in the semiconductor industry is silicon wafers, which are an influential type of semiconductor material application. Silicon wafers are widely used downstream, not only in semiconductors, but also in electronic equipment such as photovoltaics, 5G, automobiles, electronic products, and electronic information. With the increasing demand for semiconductor materials and industry investment, it is expected that wafer manufacturing materials will usher in greater market space.

The demand for downstream end products has expanded the market scale of electronic component carriers. As an important carrier and consumable part of electronic component surface mount technology, carriers are mainly used for the storage, transportation, and packaging production of passive components such as resistors, capacitors, inductors, and active components such as integrated circuits, semiconductors, chips, etc. They are essential raw materials in the entire packaging process. Similarly, cover tapes are also an indispensable part of these electronic components. With the high development of the current market, the requirements for fully automated assembly line production are becoming increasingly precise. The accuracy and other performance of the carrier and cover tapes are also constantly improving, which requires testing the technical strength of the carrier and cover tape material production companies.